Silver Sintering Equipment
Complete line equipment for silver-sintering interconnect in SiC/IGBT power modules
Solution Overview
Silver sintering is an advanced low-temperature metallurgical interconnect process for high-power-density semiconductor packaging. Using silver paste or silver film made of nano-/micro-scale silver particles as the interconnect medium, it operates in a 150–300 °C range far below the melting point of silver (961 °C). Through thermally activated solid-state diffusion of silver atoms, assisted by pressure or atmosphere control, sintering necks form between the silver particles and gradually coalesce, ultimately producing a dense sintered-silver bond layer between the die and the substrate — a solder-free metallurgical joint.
The process completely eliminates the intermetallic compound (IMC) aging and high-temperature softening issues of conventional tin-based solder. With its core characteristic of "low-temperature forming, high-temperature service", it is a key enabling technology for volume packaging of SiC/GaN wide-bandgap power devices, and is widely applied to high-voltage, high-power electronic control products in new energy vehicles, wind-power converters and industrial drives.
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